The report is a teardown analysis of the Xiaomi POCO F1. The report helps to identify the components, parts, Integrated Circuit’s etc. used in this smartphone. Thereby providing the actual component manufacturer for the components used.
Table of Contents:
- Teardown: PCBA, Battery, Liquid Cooling, Camera, SoC, RAM, Charging Port, Vibration Motor, WiFi, NAND, Power Amplifier, Audio Codec, RF
Number of Pages: 21
Author: Parv Sharma
Published Date: November 2018
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